The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Oct. 08, 2020
Industrial Technology Research Institute, Hsinchu, TW;
Yu-Min Lin, Hsinchu County, TW;
Ang-Ying Lin, Tainan, TW;
Sheng-Tsai Wu, Taoyuan, TW;
Chao-Jung Chen, Hsinchu County, TW;
Tzu-Hsuan Ni, Hsinchu, TW;
Shin-Yi Huang, Hsinchu County, TW;
Yuan-Yin Lo, Kaohsiung, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.