Kyoto, Japan

Yousuke Moriyama

This inventor holds 22 USPTO granted patents and 1 published patent application and 5 EPO patents, primarily in Electronic Device Packaging. Top assignee: Kyocera Corporation. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yousuke Moriyama. Retrieved from https://idiyas.com/inventor/yousuke-moriyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 95.5

 

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 18(Granted Patents)


Location History:

  • Satsumasendai, JP (2014 - 2016)
  • Kyoto, JP (2017 - 2024)

Company Filing History:


Years Active: 2014-2025

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Areas of Expertise:
Electronic Device
Wiring Board
Mounting Substrate
Imaging Module
Electronic Component
Image Pickup Device
Electronic Module
Substrate
22 patents (USPTO):Explore Patents

Title: **Innovations of Yousuke Moriyama: Pioneering Electronic Substrates**

Introduction

Yousuke Moriyama, based in Kyoto, Japan, is a prominent inventor known for his significant contributions to the field of electronics. With an impressive portfolio of 22 patents, Moriyama has leveraged his expertise to develop innovative solutions for modern electronic devices.

Latest Patents

Among his latest patents are groundbreaking designs for substrates that are essential for mounting electronic elements. One such patent details a substrate characterized by a first substrate that includes a first surface and a second surface opposite to the first surface. This innovative design also features a second substrate with a third surface and a fourth surface opposite to the third surface, along with heat dissipation bodies designed for improved thermal management. Notably, the heat conduction of these heat dissipation bodies is optimized to ensure efficient heat transfer in directions crucial to the performance of electronic elements. Another patent elaborates on a substrate configuration that incorporates a carbon material to enhance heat conduction, demonstrating Moriyama's commitment to advancing electronic module technology.

Career Highlights

Yousuke Moriyama has made remarkable strides in his career, primarily associated with Kyocera Corporation. His works reflect a profound understanding of electronic engineering principles and a dedication to innovation. His impressive record of patents highlights not only his individual creativity but also his integral role in the evolving landscape of electronic component design.

Collaborations

Throughout his career, Moriyama has collaborated with esteemed colleagues such as Noboru Kitazumi and Akihiko Funahashi. These collaborations have fostered an environment of innovation and shared knowledge, driving the success of their projects and contributing to advancements in the industry.

Conclusion

Yousuke Moriyama's innovative approaches to substrate design have set a benchmark in the electronics industry. With his continued dedication to research and development at Kyocera Corporation, he remains a key figure in the advancement of electronic technologies, ensuring enhanced functionality and efficiency for future devices. His work exemplifies how collaboration and creativity can lead to significant technological achievements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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