The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Mar. 28, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Yukio Morita, Kyoto, JP;

Noboru Kitazumi, Kyoto, JP;

Yousuke Moriyama, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 1/11 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 1/0206 (2013.01); H05K 1/0209 (2013.01); H05K 1/0306 (2013.01); H05K 2201/0323 (2013.01);
Abstract

A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate.


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