The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Mar. 23, 2016
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Kensaku Murakami, San Diego, CA (US);

Kouichi Kawasaki, Kyoto, JP;

Yousuke Moriyama, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 33/62 (2010.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 33/62 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 25/167 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A wiring board includes an insulating substrate, mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, and terminal electrodes arranged to face each other on a second main surface of the insulating substrate along another pair of opposing sides of the insulating substrate in a perspective plan view.


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