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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9872378 B1

PDFFull Text
Date of Patent:
Jan. 16, 2018

Filed:

Apr. 28, 2014

Electronic element mounting board and electronic device

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Shuya Kubo, Kyoto, JP;

Kouki Suda, Kyoto, JP;

Tsuyoshi Ishimabushi, Kyoto, JP;

Shinji Ichiki, Kyoto, JP;

Yousuke Moriyama, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Jenny L Wagner

Assistant Examiner:

Michael P McFadden

Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/15 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 27/146 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01L 27/14618 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 23/49866 (2013.01); H01L 2224/16225 (2013.01); H05K 1/111 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/2018 (2013.01); Y02P 70/611 (2015.11);
Abstract

There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element.

Find Patent Forward Citations

Kubo, Shuya. (2018). Electronic element mounting board and electronic device (U.S. Patent No. 9872378). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9872378

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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