logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10249564 B1

PDFFull Text
Date of Patent:
Apr. 02, 2019

Filed:

Aug. 18, 2017

Electronic component mounting substrate, electronic device, and electronic module

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Kensaku Murakami, San Diego, CA (US);

Yousuke Moriyama, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Jose R Diaz

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/057 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/057 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15323 (2013.01); H01L 2924/1631 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01);
Abstract

An electronic component mounting substrate includes an insulating base having a rectangular shape in plan view and including a first main surface, a second main surface facing the first main surface, and a recess open on the first main surface, a band-shaped metal layer on a sidewall of the recess, and an electrode extending from a bottom surface of the recess into the insulating base. The electrode has an end disposed in the insulating base, and the end includes an inclined portion inclined toward the second main surface.

Find Patent Forward Citations

Murakami, Kensaku. (2019). Electronic component mounting substrate, electronic device, and electronic module (U.S. Patent No. 10249564). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10249564

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…