The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
May. 31, 2013
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Akihiko Funahashi, Kyoto, JP;
Masatsugu Iiyama, Kyoto, JP;
Kanae Horiuchi, Kyoto, JP;
Yousuke Moriyama, Kyoto, JP;
Assignee:
KYOCERA Corporation, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H05K 1/18 (2006.01); H01L 23/04 (2006.01); H01L 27/146 (2006.01); H05K 1/02 (2006.01); H01L 33/48 (2010.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/04 (2013.01); H01L 27/14618 (2013.01); H05K 1/0296 (2013.01); H01L 33/486 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H05K 1/0306 (2013.01); H05K 1/183 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/2009 (2013.01);
Abstract
There are provided an electronic device mounting board and an electronic apparatus that can be made lower in profile. An electronic device mounting board includes an insulating substrate having an opening in which an electronic device is disposed so as to lie over the opening as seen in a transparent plan view, and a reinforcement portion disposed on a surface or in an interior of the insulating substrate so as to lie around the opening of the insulating substrate as seen in a transparent plan view.