The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

May. 21, 2019
Applicant:

Kyocera Corporation, Kyoto, Kyoto, JP;

Inventors:

Michio Imayoshi, Kyoto, JP;

Yousuke Moriyama, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 33/52 (2010.01); H01L 23/36 (2006.01); H01L 25/16 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/486 (2013.01); H01L 21/4807 (2013.01); H01L 21/4853 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H05K 1/02 (2013.01); H05K 3/46 (2013.01); H01L 23/36 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/167 (2013.01); H01L 33/647 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3511 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A wiring board includes an insulating substrate that is rectangular in a plan view, a plurality of mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, a plurality of terminal electrodes arranged to face each other on a second main surface of the insulating substrate along the pair of opposing sides of the insulating substrate in a perspective plan view, and an inner metal layer arranged inside the insulating substrate and extending in a direction perpendicular to the pair of opposing sides of the insulating substrate in a perspective plan view.


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