You Yang Ong

Title: You Yang Ong: Innovator in Integrated Circuit Technology

Introduction

You Yang Ong is a prominent inventor based in Singapore, known for his significant contributions to the field of integrated circuit technology. With a total of 14 patents to his name, Ong has made remarkable advancements that have influenced the electronics industry.

Latest Patents

Among his latest innovations is the "Stacked Integrated Circuit Package System." This invention involves forming a lead and a die paddle from a lead frame, creating a first integrated circuit die with an interconnect, and placing a second integrated circuit die over the first. The system connects the second die to the lead and encapsulates both dies with a portion of the lead and interconnect exposed. Another notable patent is the "Embedded Integrated Circuit Package-on-Package System." This system includes forming a first integrated circuit package and a second package, which is then mounted over the first. The combination can be an embedded integrated circuit package system or an embedded stacked integrated circuit package system.

Career Highlights

Ong has worked with several notable companies, including Stats Chippac Pte. Ltd. and Orthodyne Electronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the field of electronics.

Collaborations

Some of his notable coworkers include Dioscoro A Merilo and Seng Guan Chow. Their collaboration has likely fostered an environment of innovation and creativity, further enhancing the development of integrated circuit technologies.

Conclusion

You Yang Ong's contributions to integrated circuit technology through his patents and career achievements highlight his role as a key innovator in the electronics industry. His work continues to influence advancements in this critical field.