The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Jan. 27, 2006
Applicants:
Wai Kwong Tang, Singapore, SG;
You Yang Ong, Kuantan, MY;
Kuan Ming Kan, Seremban, MY;
Larry Lewellen, San Jose, CA (US);
Inventors:
Wai Kwong Tang, Singapore, SG;
You Yang Ong, Kuantan, MY;
Kuan Ming Kan, Seremban, MY;
Larry Lewellen, San Jose, CA (US);
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate lead, mounting a power semiconductor device on the lower lead frame utilizing interconnect structures and forming an upper lead frame wherein the upper lead frame is on the power semiconductor device.