Company Filing History:
Years Active: 2009
Title: Innovations by Wai Kwong Tang
Introduction
Wai Kwong Tang is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, his work focuses on enhancing power semiconductor package systems.
Latest Patents
Wai Kwong Tang's latest patents include a "Stackable Power Semiconductor Package System." This invention provides a method for creating a stackable power semiconductor package system, which involves forming a lower lead frame with an upward bent source lead and gate lead. It also includes mounting a power semiconductor device on the lower lead frame using interconnect structures and forming an upper lead frame positioned on the power semiconductor device.
Another significant patent is the "Thermally Enhanced Power Semiconductor Package System." This invention offers a thermally enhanced power semiconductor package system that includes a power semiconductor die. It features an upper lead frame formed on the power semiconductor die and a lower lead frame positioned below it. The upper and lower lead frames are arranged in an offset configuration to create two heat dissipation paths.
Career Highlights
Wai Kwong Tang is currently associated with Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the efficiency and performance of power semiconductor devices.
Collaborations
Wai Kwong Tang has collaborated with notable colleagues such as You Yang Ong and Kuan Ming Kan. Their combined expertise has contributed to the successful development of innovative semiconductor technologies.
Conclusion
Wai Kwong Tang's contributions to semiconductor technology through his patents demonstrate his commitment to innovation. His work continues to influence the industry and pave the way for future advancements in power semiconductor systems.