The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2009
Filed:
Jan. 31, 2006
Wai Kwong Tang, Singapore, SG;
You Yang Ong, Kuantan, MY;
Kuan Ming Kan, Seremban, MY;
Larry Lewellen, San Jose, CA (US);
Wai Kwong Tang, Singapore, SG;
You Yang Ong, Kuantan, MY;
Kuan Ming Kan, Seremban, MY;
Larry Lewellen, San Jose, CA (US);
Stats Chippac Ltd., Singapore, SG;
Abstract
The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and forming a lower lead frame below the power semiconductor die, wherein the upper lead frame and the lower lead frame are provided in an offset configuration relative to each other to provide two heat dissipation paths.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile