Company Filing History:
Years Active: 2009
Title: Larry Lewellen: Innovator in Power Semiconductor Packaging
Introduction
Larry Lewellen is a notable inventor based in San Jose, CA (US), recognized for his contributions to the field of power semiconductor packaging. With a total of 2 patents to his name, Lewellen has made significant advancements that enhance the efficiency and thermal management of semiconductor devices.
Latest Patents
Lewellen's latest patents include the "Stackable Power Semiconductor Package System" and the "Thermally Enhanced Power Semiconductor Package System." The stackable power semiconductor package system provides a method for creating a package that includes a lower lead frame with upward bent source and gate leads, allowing for efficient mounting of power semiconductor devices. The thermally enhanced power semiconductor package system features an innovative design that includes an upper lead frame and a lower lead frame in an offset configuration, which facilitates two distinct heat dissipation paths, thereby improving thermal performance.
Career Highlights
Larry Lewellen is currently employed at Stats Chippac Pte. Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the capabilities of power semiconductor devices, making them more efficient and reliable for various applications.
Collaborations
Some of his notable coworkers include Wai Kwong Tang and You Yang Ong, who have collaborated with Lewellen on various projects within the semiconductor industry.
Conclusion
Larry Lewellen's innovative work in power semiconductor packaging has made a significant impact on the industry. His patents reflect a commitment to enhancing the performance and efficiency of semiconductor devices, solidifying his reputation as a leading inventor in this field.