The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Mar. 24, 2009
Applicants:
Dioscoro A. Merilo, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
You Yang Ong, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Ma. Shirley Asoy, Singapore, SG;
Inventors:
Dioscoro A. Merilo, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
You Yang Ong, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Ma. Shirley Asoy, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.