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Wilmington, DE, United States of America

Orthodyne Electronics Corporation

USPTO Granted Patents = 39

Trademarks = 1

Forward Citations = 244

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26 inventors (with patents filed for the assignee):

Christoph Benno Luechinger (17 out of 26 patents)

Orlando Luis Valentin (10 out of 14 patents)

Tao Xu (7 out of 8 patents)

4. Theodore J Copperthite (6 out of 14 patents)

5. Jonathan Michael Byars (5 out of 6 patents)

6. Mark Arnold Delsman (4 out of 6 patents)

7. Todd James Walker (3 out of 8 patents)

8. Garrett Leigh Wong (3 out of 4 patents)

9. Michael C Smith (3 out of 4 patents)

10. Hal W Smith, Jr (3 out of 3 patents)

11. Vartan Babayan (2 out of 2 patents)

12. Erich Christoph Mueller (2 out of 2 patents)

13. Dominick A DeAngelis (1 out of 19 patents)

14. Garrett W Jones (1 out of 3 patents)

15. Tick-Kwang Loh (1 out of 3 patents)

39 patents: Sort by Forward Citations

1. 9931709 - Wedge bonding tools, wedge bonding systems, and related methods (2018-04-03),

2. 9929122 - Ribbon bonding tools and methods of using the same (2018-03-27),

3. 9925624 - Methods and systems for aligning tooling elements of ultrasonic bonding systems (2018-03-27),

4. 9527189 - Systems and methods for processing solar substrates (2016-12-27),

5. 9393641 - Methods and systems for aligning tooling elements of ultrasonic bonding systems (2016-07-19),

6. 9038998 - Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations (2015-05-26),

7. 8998063 - Wire loop forming systems and methods of using the same (2015-04-07),

8. 8926760 - Systems and methods for processing solar substrates (2015-01-06),

9. 8820609 - Wire bonding tool (2014-09-02),

10. 8746537 - Ultrasonic bonding systems and methods of using the same (2014-06-10),

11. 8720767 - Semiconductor device support for bonding (2014-05-13),

12. 8685791 - Ribbon bonding in an electronic package (2014-04-01),

13. 8685789 - Ribbon bonding in an electronic package (2014-04-01),

14. 8651360 - Systems and methods for processing ribbon and wire in ultrasonic bonding systems (2014-02-18),

15. 8651354 - Ultrasonic bonding systems including workholder and ribbon feeding system (2014-02-18),

Orthodyne Electronics Corporation is a leading manufacturer of precision bondtesters and process equipment for the semiconductor industry. With over 40 years of experience, Orthodyne continues to deliver high-quality solutions that ensure the reliable production of electronic components. Their bondtesters are designed to measure the strength and integrity of electrical connections in semiconductor devices, helping manufacturers optimize their production processes and improve overall product quality.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

39 Patents

#116 in Wilmington, DE

#149 in Delaware

#8,535 in US

#16,914 in the World

Wilmington, DE, United States of America

Orthodyne Electronics Corporation

Forward Citations = 244

26 inventors:

Christoph Benno Luechinger (17 out of 26 patents)

Orlando Luis Valentin (10 out of 14 patents)

Tao Xu (7 out of 8 patents)

4. Theodore J Copperthite (6 out of 14 patents)

5. Jonathan Michael Byars (5 out of 6 patents)

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