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Irvine, CA, United States of America

Orthodyne Electronics Corporation

USPTO Granted Patents = 39

% Expired Patents = 10.3

Trademarks = 1

Forward Citations = 257

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26 inventors (with patents filed for the assignee):

Christoph Benno Luechinger (17 out of 29 patents)

Orlando Luis Valentin (10 out of 14 patents)

Tao Xu (7 out of 8 patents)

4. Theodore J Copperthite (6 out of 14 patents)

5. Jonathan Michael Byars (5 out of 6 patents)

6. Mark Arnold Delsman (4 out of 6 patents)

7. Todd James Walker (3 out of 9 patents)

8. Garrett Leigh Wong (3 out of 4 patents)

9. Michael C Smith (3 out of 4 patents)

10. Hal W Smith, Jr (3 out of 3 patents)

11. Vartan Babayan (2 out of 2 patents)

12. Erich Christoph Mueller (2 out of 2 patents)

13. Dominick A DeAngelis (1 out of 19 patents)

14. Garrett W Jones (1 out of 3 patents)

15. Tick-Kwang Loh (1 out of 3 patents)

Core Competencies:

Wedge Bonding Tools

Ultrasonic Bonding Systems

Ribbon Bonding

Semiconductor Devices

Solar Substrates

Wire Loop Forming

Clamping Systems

Integrated Circuit Package

Automated Filament Attachment

Bonding Methods

Bonding Tool

Wire Bonding Systems

39 patents: Sort by Forward Citations

1. 9931709 - Wedge bonding tools, wedge bonding systems, and related methods (2018-04-03),

2. 9929122 - Ribbon bonding tools and methods of using the same (2018-03-27),

3. 9925624 - Methods and systems for aligning tooling elements of ultrasonic bonding systems (2018-03-27),

4. 9527189 - Systems and methods for processing solar substrates (2016-12-27),

5. 9393641 - Methods and systems for aligning tooling elements of ultrasonic bonding systems (2016-07-19),

6. 9038998 - Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations (2015-05-26),

7. 8998063 - Wire loop forming systems and methods of using the same (2015-04-07),

8. 8926760 - Systems and methods for processing solar substrates (2015-01-06),

9. 8820609 - Wire bonding tool (2014-09-02),

10. 8746537 - Ultrasonic bonding systems and methods of using the same (2014-06-10),

11. 8720767 - Semiconductor device support for bonding (2014-05-13),

12. 8685791 - Ribbon bonding in an electronic package (2014-04-01),

13. 8685789 - Ribbon bonding in an electronic package (2014-04-01),

14. 8651360 - Systems and methods for processing ribbon and wire in ultrasonic bonding systems (2014-02-18),

15. 8651354 - Ultrasonic bonding systems including workholder and ribbon feeding system (2014-02-18),

Company Overview

Orthodyne Electronics Corporation, based in Irvine, California, specializes in advanced electronic packaging and assembly solutions. The company focuses on developing innovative technologies for the semiconductor and electronics industries, particularly in areas such as wire bonding and die attach processes. With a commitment to enhancing manufacturing efficiency and product reliability, Orthodyne plays a crucial role in supporting the growth of high-performance electronic devices across various applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

39 Patents

#88 in Irvine, CA

#2,094 in California

#8,830 in US

#17,465 in the World

Irvine, CA, United States of America

Orthodyne Electronics Corporation

Forward Citations = 257

26 inventors:

Christoph Benno Luechinger (17 out of 29 patents)

Orlando Luis Valentin (10 out of 14 patents)

Tao Xu (7 out of 8 patents)

4. Theodore J Copperthite (6 out of 14 patents)

5. Jonathan Michael Byars (5 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Orthodyne Electronics Corporation. Retrieved from https://idiyas.com/company/orthodyne-electronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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