The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Jan. 22, 2013
Applicant:
Orthodyne Electronics Corporation, Irvine, CA (US);
Inventor:
Jonathan Michael Byars, Fountain Valley, CA (US);
Assignee:
Orthodyne Electronics Corporation, Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); B23K 31/02 (2006.01); H01L 21/67 (2006.01); B23K 35/00 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67138 (2013.01); B23K 35/00 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); B23K 20/004 (2013.01); H01L 2224/48456 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/78 (2013.01); H01L 2224/85 (2013.01); Y10S 228/904 (2013.01);
Abstract
A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.