The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Nov. 16, 2010
Applicant:
Jonathan Michael Byars, Fountain Valley, CA (US);
Inventor:
Jonathan Michael Byars, Fountain Valley, CA (US);
Assignee:
Orthodyne Electronics Corporation, Irvine, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23Q 3/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 24/78 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/78 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/78703 (2013.01); H01L 2224/85205 (2013.01); H01L 24/48 (2013.01); H01L 24/97 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/85206 (2013.01); H01L 2924/00014 (2013.01); H01L 24/34 (2013.01); Y10S 269/903 (2013.01);
Abstract
A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.