Osaka, Japan

Yosuke Nakasato

USPTO Granted Patents = 9 


Average Co-Inventor Count = 3.7

ph-index = 1


Location History:

  • Osaka, JP (2014 - 2018)
  • Kitamoto, JP (2018)

Company Filing History:


Years Active: 2014-2018

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9 patents (USPTO):Explore Patents

Title: Yosuke Nakasato: Innovator in Copper Alloy Technology

Introduction

Yosuke Nakasato is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper alloys. With a total of nine patents to his name, Nakasato's work has advanced the understanding and application of copper materials in various industries.

Latest Patents

Nakasato's latest patents include a copper-alloy plate for terminal and connector materials, along with a method for producing this innovative material. The copper alloy sheet contains specific percentages of zinc, tin, phosphorus, and nickel, ensuring optimal properties for electrical conductivity and stress relaxation resistance. His research has led to the creation of a copper alloy that meets stringent requirements for bending workability and solderability, making it highly suitable for modern electronic applications.

Career Highlights

Throughout his career, Nakasato has worked with notable companies such as Mitsubishi Materials Corporation and Mitsubishi Shindoh Co., Ltd. His experience in these organizations has allowed him to refine his expertise in material development and innovation. Nakasato's dedication to research and development has positioned him as a key figure in the advancement of copper alloy technology.

Collaborations

Nakasato has collaborated with esteemed colleagues, including Keiichiro Oishi and Takashi Hokazono. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas in the field of materials science.

Conclusion

Yosuke Nakasato's contributions to copper alloy technology have had a lasting impact on the industry. His innovative patents and collaborative efforts continue to shape the future of materials used in electronics and other applications.

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