The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Jul. 31, 2009
Applicants:
Kazunari Maki, Saitama, JP;
Kenichi Yaguchi, Ageo, JP;
Yosuke Nakasato, Osaka, JP;
Haruhiko Asao, Tokyo, JP;
Inventors:
Kazunari Maki, Saitama, JP;
Kenichi Yaguchi, Ageo, JP;
Yosuke Nakasato, Osaka, JP;
Haruhiko Asao, Tokyo, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 9/05 (2006.01); C23C 14/16 (2006.01); H01L 21/285 (2006.01); H01L 23/532 (2006.01); H05K 1/09 (2006.01); C23C 14/14 (2006.01); H05K 1/03 (2006.01); H05K 3/16 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); C22C 9/00 (2013.01); C22C 9/01 (2013.01); C22C 9/05 (2013.01); C23C 14/14 (2013.01); C23C 14/165 (2013.01); H01L 21/2855 (2013.01); H01L 23/53233 (2013.01); H05K 1/09 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 3/16 (2013.01); Y10T 428/12431 (2015.01);
Abstract
A copper alloy wiring film of a flat panel display of the present invention and a sputtering target for forming the same have a composition including Mg: 0.1 to 5 atom %; either one or both of Mn and Al: 0.1 to 11 atom % in total; and Cu and inevitable impurities as the balance, and if necessary, may be further including P: 0.001 to 0.1 atom %.