The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Sep. 26, 2014
Applicant:
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI SHINDOH CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/04 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01); B22D 21/00 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01);
U.S. Cl.
CPC ...
C22C 9/04 (2013.01); B22D 21/005 (2013.01); C21D 8/0236 (2013.01); C21D 8/0273 (2013.01); C21D 9/46 (2013.01); C22F 1/00 (2013.01); C22F 1/08 (2013.01);
Abstract
Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17≤f1=[Zn]+5×[Sn]−2×[Ni]≤30, 14≤f2=[Zn]−0.5×[Sn]−3×[Ni]≤26, 8≤f3={f1×(32−f1)}×[Ni]≤23, 1.3≤[Ni]+[Sn]≤2.4, 1.5≤[Ni]/[Sn]≤5.5, and 20≤[Ni]/[P]≤400 are satisfied. The copper alloy has a metallographic structure of an α single phase.