The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Mar. 24, 2016
Mitsubishi Shindoh Co, Ltd., Tokyo, JP;
Keiichiro Oishi, Osaka, JP;
Yosuke Nakasato, Kitamoto, JP;
Katsuhiko Hata, Osaka, JP;
Shinji Tanaka, Osaka, JP;
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Abstract
A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≦f1=[Zn]+5×[Sn]−2×[Ni]≦30, 10≦[Zn]−0.3×[Sn]−2×[Ni]≦28, 10≦f3={f1×(32−f1)×[Ni]}≦33, 1.2≦0.7×[Ni]+[Sn]≦4, and 1.4≦[Ni]/[Sn]≦90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ) % and an area ratio of a β phase (β) % in an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7.