Company Filing History:

11 out of 1,641

Hitachi Chemical Company, Ltd.

patents

4. 2 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1989-2015

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14 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8997341 - Substrate for mounting semiconductor chip and method for producing same (2015-04-07),

2. 7187072 - Fabrication process of semiconductor package and semiconductor package (2007-03-06),

3. 6746897 - Fabrication process of semiconductor package and semiconductor package (2004-06-08),

4. 6568073 - Process for the fabrication of wiring board for electrical tests (2003-05-27),

5. 6365432 - Fabrication process of semiconductor package and semiconductor package (2002-04-02),

6. 6236108 - Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package (2001-05-22),

7. 6223429 - Method of production of semiconductor device (2001-05-01),

8. 6133534 - Wiring board for electrical tests with bumps having polymeric coating (2000-10-17),

9. 6064111 - Substrate for holding a chip of semi-conductor package, semi-conductor (2000-05-16),

10. 5976912 - Fabrication process of semiconductor package and semiconductor package (1999-11-02),

11. 5664325 - Fabrication process of wiring board (1997-09-09),

12. 5504992 - Fabrication process of wiring board (1996-04-09),

13. 5426850 - Fabrication process of wiring board (1995-06-27),

14. 4830691 - Process for producing high-density wiring board (1989-05-16),

Title: Yoshiaki Tsubomatsu: Innovator in Semiconductor Technology

Introduction

Yoshiaki Tsubomatsu is a prominent inventor based in Tsuchiura, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on improving the reliability and efficiency of semiconductor packaging and mounting processes.

Latest Patents

One of Tsubomatsu's latest patents is for a substrate for mounting semiconductor chips and the method for producing the same. This invention aims to reduce bridging and enhance wire bondability and solder connection reliability, even when forming fine-pitch wirings. The method involves several steps, including forming a resist on a copper layer, creating a conductor circuit through electrolytic copper plating, and applying a nickel layer. The process concludes with the formation of a gold layer, ensuring high-quality connections for semiconductor applications.

Another notable patent involves the fabrication process of a semiconductor package. This innovation addresses the growing demand for high integration in semiconductors. The process includes plating a nickel layer on an electroplated copper foil, mounting an LSI chip, and connecting terminals through wire bonding. The package is then sealed with a semiconductor-sealing epoxy resin, ensuring durability and performance.

Career Highlights

Throughout his career, Tsubomatsu has worked with reputable companies, including Hitachi Chemical Company, Ltd. His experience in the industry has allowed him to develop cutting-edge technologies that advance semiconductor manufacturing.

Collaborations

Tsubomatsu has collaborated with notable colleagues, including Naoki Fukutomi and Toshio Yamazaki. These partnerships have contributed to the success of his innovative projects and patents.

Conclusion

Yoshiaki Tsubomatsu is a key figure in the semiconductor industry, with a strong portfolio of patents that reflect his expertise and innovative spirit. His contributions continue to shape the future of semiconductor technology and enhance the reliability of electronic devices.

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