The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 1989
Filed:
Mar. 31, 1987
Applicant:
Inventors:
Akinari Kida, Shimodate, JP;
Naoki Fukutomi, Yuki, JP;
Yoshiaki Tsubomatsu, Shimodate, JP;
Takuya Yasuoka, Shimodate, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C03C / ; C03C / ; C23F / ;
U.S. Cl.
CPC ...
156631 ; 29846 ; 29852 ; 156634 ; 156655 ; 1566591 ; 156668 ; 156150 ; 156233 ; 156901 ; 156902 ; 427 97 ; 430317 ; 430318 ;
Abstract
A wiring board comprising (A) a base substrate on which the necessary wiring pattern has already been formed, and (B) a multi-layer substrate bonded to the wiring pattern side of said base substrate (A) and comprising heat-resistant resin layers and thin-film wiring patterns formed by a thin film forming method under vacuum can mount LSI chips on the substrate and realize increased density of signal wiring.