Location History:
- Tokyo, JP (2002 - 2004)
- Yuki-shi, Ibaraki-ken, JP (2004)
- Yuki, JP (1980 - 2007)
Company Filing History:
16 out of 1,641 
1 out of 3 
1 out of 2,767 
Years Active: 1980-2007
Title: Innovations by Naoki Fukutomi: A Seminal Contributor to Semiconductor Packaging
Introduction
Naoki Fukutomi, a prominent inventor based in Yuki, Japan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 17 patents, Fukutomi's innovations focus primarily on advancing semiconductor packaging processes, essential for supporting the growing demand for high integration in electronics.
Latest Patents
Among Fukutomi's latest patents is a groundbreaking fabrication process for semiconductor packages. This invention presents a substrate method that meets the requirements of high integration semiconductors. The innovative process involves plating a nickel layer on electroplated copper foil to create a wiring pattern. An LSI chip is mounted onto the copper foil and connected through wire bonding to the wiring pattern, which is then sealed with a semiconductor-sealing epoxy resin. The copper foil is selectively dissolved using an alkali etchant to reveal the nickel layer. A specialized nickel stripper with low copper-dissolving power is employed to remove the nickel, exposing the wiring pattern. Following this, a solder resist is coated to form a pattern that keeps connecting terminal portions exposed, where solder balls are placed and fused to connect with an external printed board.
Career Highlights
Naoki Fukutomi has held notable positions in respected companies, including Hitachi Chemical Company, Ltd. and Hitachi Condenser Co., Ltd. Throughout his career, he has focused on enhancing semiconductor packaging technologies, significantly influencing advancements in the industry.
Collaborations
Fukutomi has collaborated with significant figures in the industry, including Yoshiaki Tsubomatsu and Toshio Yamazaki. Their combined expertise likely contributed to the innovative processes that Fukutomi has developed over the years, fostering a collaborative environment that encourages invention and design refinement.
Conclusion
Through his inventive work and collaboration with esteemed colleagues, Naoki Fukutomi has established himself as a vital contributor to the semiconductor technology field. His developments in semiconductor packaging not only enhance the effectiveness of electronic components but also pave the way for future innovations in high-performance electronics.