The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1992
Filed:
Apr. 10, 1989
Applicant:
Inventors:
Hiroshi Takahashi, Kasama, JP;
Shin Takanezawa, Shimodate, JP;
Masao Kanno, Shimodate, JP;
Toshiro Okamura, Shimodate, JP;
Naoki Fukutomi, Yuki, JP;
Hiroyoshi Yokoyama, Yuki, JP;
Hideo Watanabe, Kanagawa, JP;
Hajime Yamazaki, Hadano, JP;
Hiroyuki Wakamatsu, Kawasaki, JP;
Toshinobu Takahashi, Kanagawa, JP;
Assignees:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Hitachi, Condenser Co., Ltd., Tokyo, JP;
Yokohama Rubber Company Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29852 ; 29848 ; 427 97 ;
Abstract
By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.