Toshiro Okamura

Title: Toshiro Okamura: Innovator in Multilayer Printed Wiring Board Technology

Introduction

Toshiro Okamura is a prominent inventor based in Shimodate, Japan. He has made significant contributions to the field of electronics, particularly in the manufacturing of multilayer printed wiring boards. With a total of 15 patents to his name, Okamura's work has had a lasting impact on the industry.

Latest Patents

Among his latest patents is a method of manufacturing multilayer printed wiring boards. This innovative method includes an internal wiring circuit formed on a board, an insulating resin layer, and a blind hole that communicates with the internal wiring circuit. The blind hole is created using a short-pulse CO₂ laser, which enhances the precision of the manufacturing process. Another notable patent is a process for producing multiple wire wiring boards. This process involves an adhesive that comprises solid epoxy resin, polyfunctional epoxy resin, and a cationic photoinitiator, among other components. This adhesive is designed to provide excellent heat and solvent resistance, ensuring that the adhesive layer remains void-free and prevents the shift of insulated encapsulated wires.

Career Highlights

Throughout his career, Toshiro Okamura has worked with esteemed companies such as Hitachi Chemical Company, Ltd. and Hitachi Aic Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in wiring board technology.

Collaborations

Okamura has collaborated with notable colleagues, including Yorio Iwasaki and Akishi Nakaso. These partnerships have fostered innovation and have been instrumental in the development of new technologies in the field.

Conclusion

Toshiro Okamura's contributions to multilayer printed wiring board technology exemplify his dedication to innovation. His patents and career achievements highlight his role as a leading inventor in the electronics industry.