The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 1991
Filed:
Sep. 18, 1989
Applicant:
Inventors:
Shin Takanezawa, Shimodate, JP;
Yorio Iwasaki, Shimodate, JP;
Hiroshi Takaahashi, Kasama, JP;
Toshiro Okamura, Shimodate, JP;
Saburo Amano, Yuki, JP;
Hiroyoshi Yokoyama, Yuki, JP;
Noriyoshi Fukuoka, Takaoka, JP;
Tatsuya Amano, Moda, JP;
Assignee:
Hitachi-Chemical Co., Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428413 ; 428209 ; 428901 ; 427 96 ; 427404 ; 4274071 ; 106-111 ;
Abstract
An adhesive composition for producing printed wiring boards comprising (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating, and (E) a coupling agent having an ethylene or vinyl group, is useful in a so-called additive process.