The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1998
Filed:
Dec. 18, 1996
Applicant:
Inventors:
Satoshi Isoda, Tochigi, JP;
Yasuhiro Iwasaki, Tochigi, JP;
Kenshirou Fukuzato, Tochigi, JP;
Tsutomu Zama, Tochigi, JP;
Koichi Noguchi, Tochigi, JP;
Toshiro Okamura, Tochigi, JP;
Hiroyoshi Yokoyama, Tochigi, JP;
Youiti Matuda, Tochigi, JP;
Assignee:
Hitachi AIC Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K / ;
U.S. Cl.
CPC ...
29852 ; 2191217 ; 21912171 ; 21912174 ; 427 97 ;
Abstract
In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conductive portion formed on an inner wall of the blind hole and connected to the internal wiring circuit, the blind hole is formed by using a short-pulse CO.sub.2 laser.