The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 1990
Filed:
Jul. 27, 1988
Applicant:
Inventors:
Akishi Nakaso, Oyama, JP;
Toshiro Okamura, Shimodate, JP;
Haruo Ogino, Shimodate, JP;
Tomoko Watanabe, Ibaraki, JP;
Yuko Kimura, Shimodate, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B44C / ;
U.S. Cl.
CPC ...
428137 ; 29852 ; 148269 ; 148272 ; 156151 ; 156253 ; 156281 ; 156314 ; 156630 ; 156902 ; 204 27 ; 204 381 ; 428901 ;
Abstract
Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.