Shimodate, Japan

Masao Kanno

This inventor holds 4 USPTO granted patents. Top assignees: Hitachi Chemical Company, Ltd., Hitachi, Condenser Co., Ltd., The Yokohama Rubber Co., Ltd.. Active years: 1988-2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masao Kanno. Retrieved from https://idiyas.com/inventor/masao-kanno-foa5wobi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.2

ph-index = 4

Forward Citations = 159(Granted Patents)


Location History:

  • Shimodate, JP (1988 - 1994)
  • Oyama, JP (2000)

Company Filing History:


Years Active: 1988-2000

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4 patents (USPTO):Explore Patents

Title: Masao Kanno: Innovator in Circuit Board Technology

Introduction

Masao Kanno is a notable inventor based in Shimodate, Japan. He has made significant contributions to the field of circuit board technology, holding a total of 4 patents. His work focuses on enhancing the performance and durability of circuit boards through innovative materials and processes.

Latest Patents

One of Kanno's latest patents involves the development of circuit boards using heat-resistant resin for adhesive layers. This adhesive composition includes a polyamide-imide resin with a molecular weight of 80,000 or more, combined with a thermosetting component that includes an epoxy resin and a curing agent. This innovation provides an insulating adhesive layer with a storage elastic modulus at 300°C of 30 MPa or more and a glass transition temperature of 180°C or higher. The insulating adhesive is particularly suitable for wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.

Another significant patent by Kanno details a process for producing printed wiring boards. This process is characterized by forming a nickel layer through electroless plating, followed by a copper layer also formed by electroless plating. Alternatively, a copper undercoating layer can be formed before the nickel layer. This method results in printed circuit boards that exhibit excellent resistance to electrolytic corrosion and are suitable for high-density component mounting.

Career Highlights

Throughout his career, Masao Kanno has worked with prominent companies such as Hitachi Chemical Company, Ltd. and Hitachi Condenser Co., Ltd. His experience in these organizations has allowed him to refine his expertise in circuit board technology and contribute to advancements in the field.

Collaborations

Kanno has collaborated with several talented individuals, including Hiroshi Takahashi and Shin Takanezawa. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Masao Kanno's contributions to circuit board technology through his innovative patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence the industry, paving the way for advancements in electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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