The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 1994
Filed:
Nov. 02, 1992
Applicant:
Inventors:
Hiroshi Takahashi, Kasama, JP;
Shin Takanezawa, Shimodate, JP;
Masao Kanno, Shimodate, JP;
Yorio Iwasaki, Shimodate, JP;
Toshirou Okamura, Shimodate, JP;
Akishi Nakaso, Oyama, JP;
Kiyoshi Hasegawa, Yuki, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K / ;
U.S. Cl.
CPC ...
29852 ; 29846 ; 174266 ; 427306 ;
Abstract
A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.