The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 1996
Filed:
Jun. 30, 1994
Naoki Fukutomi, Yuki, JP;
Yoshiaki Tsubomatsu, Tsuchiura, JP;
Toshio Yamazaki, Tsukuba, JP;
Masahiko Itabashi, Mitsukaido, JP;
Hirohito Ohhata, Tsukuba, JP;
Abstract
The object of the present invention is to provide a wiring board fabrication process which is, not only so smooth on the surface that a fine wiring pattern can be formed thereon, but also suitable for mounting electronic parts having fine pitch terminals. The present invention is a fabrication process of a wiring board which comprises a wiring conductive line embedded in the surface of an insulating substrate so that the upper face of the conductive line and the surface of the substrate are flat, and a through-hole land which is a conductive portion projected from the surface of the substrate in a through-hole portion, which is characterized in removing the conductive portion projected from the surface of the substrate in the through-hole portion so as to have a flat surface on the surface of the substrate.