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For the Inventor, By the Inventor

Ibaraki, Japan

Toshio Yamazaki

This inventor holds 11 USPTO granted patents. Top assignees: Hitachi Chemical Company, Ltd., Hitachi Co., Ltd, Sharp Corporation. Active years: 1996-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshio Yamazaki. Retrieved from https://idiyas.com/inventor/toshio-yamazaki-yqlij5yy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11

% Patents Active = 63.6

Average Co-Inventor Count = 6.8

ph-index = 9

Forward Citations = 568(Granted Patents)


Location History:

  • Ogo-ri, JP (2002)
  • Tsukuba-shi, Ibaraki-ken, JP (2004)
  • Tsukuba, JP (1996 - 2007)
  • Ibaraki-ken, JP (2007 - 2010)

Company Filing History:

goldMedal8 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
silverMedal1 out of 2 
 
Hitachi Co., Ltd
 patents
bronzeMedal1 out of 847 
 
Sharp Corporation
 patents
4. 2 out of 834,601 
Other
 patents
where one patent can have more than one assignee

Years Active: 1996-2010

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11 patents (USPTO):Explore Patents
1. 7704799 - Method of manufacturing wiring substrate (2010-04-27),
2. 7205645 - Wiring board, semiconductor device, and method of manufacturing wiring board (2007-04-17),
3. 7187072 - Fabrication process of semiconductor package and semiconductor package (2007-03-06),
4. 6746897 - Fabrication process of semiconductor package and semiconductor package (2004-06-08),
5. 6492203 - Semiconductor device and method of fabrication thereof (2002-12-10),
6. 6365432 - Fabrication process of semiconductor package and semiconductor package (2002-04-02),
7. 6236108 - Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package (2001-05-22),
8. 6223429 - Method of production of semiconductor device (2001-05-01),
9. 6064111 - Substrate for holding a chip of semi-conductor package, semi-conductor (2000-05-16),
10. 5976912 - Fabrication process of semiconductor package and semiconductor package (1999-11-02),
11. 5504992 - Fabrication process of wiring board (1996-04-09),

Sure, here is the article about inventor Toshio Yamazaki:

Title: Unveiling the Innovation Journey of Toshio Yamazaki

Introduction:

Toshio Yamazaki is a prolific inventor hailing from Ibaraki-ken, Japan. With an impressive portfolio of 11 patents to his name, Yamazaki has been a trailblazer in the field of manufacturing and semiconductor technology.

Latest Patents:

Among his latest patents is the "Method of manufacturing wiring substrate," which revolutionizes the production of wiring substrates by incorporating buried conductors that enhance the functionality and structural integrity of the substrate. This innovative approach includes the formation of aligning parts for three-dimensional mounting structures, showcasing Yamazaki's ingenuity and forward-thinking mindset.

Career Highlights:

Yamazaki's career has been adorned with significant achievements, including his tenure at renowned companies such as Hitachi Chemical Company, Ltd. His expertise and innovative spirit have played a pivotal role in shaping the landscape of manufacturing and semiconductor industries.

Collaborations:

Throughout his career, Yamazaki has collaborated with esteemed professionals in the field, including Yoshiaki Tsubomatsu and Fumio Inoue. These collaborations have led to the development of cutting-edge technologies and solutions that have made a lasting impact on the industry.

Conclusion:

In conclusion, Toshio Yamazaki stands as a beacon of innovation and creativity in the realm of manufacturing and semiconductor technology. His relentless pursuit of excellence and his groundbreaking inventions have solidified his position as a visionary inventor, shaping the future of the industry.

If you need further information or details, feel free to reach out.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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