Hirohito Ohhata is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on enhancing the integration and efficiency of semiconductor devices.

Latest Patents

One of Hirohito Ohhata's latest patents involves a fabrication process for semiconductor packages. This innovative process addresses the growing demand for high integration of semiconductors. The method includes plating a nickel layer on electroplated copper foil to create a wiring pattern. An LSI chip is then mounted on the copper foil, with connections made through wire bonding. The assembly is sealed with a semiconductor-sealing epoxy resin. The copper foil is subsequently dissolved using an alkali etchant to reveal the nickel layer. A nickel stripper with low copper-dissolving power is used to remove the nickel layer, exposing the wiring pattern. A solder resist is applied, and a pattern is formed to expose the connecting terminal portions. Finally, solder balls are placed at these exposed areas and fused, allowing the wiring pattern to connect to an external printed board via the solder balls.

Career Highlights

Hirohito Ohhata has worked with notable companies, including Hitachi Chemical Company, Ltd. His experience in the semiconductor industry has been instrumental in his innovative contributions.

Collaborations

Hirohito Ohhata has collaborated with esteemed colleagues such as Naoki Fukutomi and Yoshiaki Tsubomatsu. Their combined expertise has further advanced the field of semiconductor packaging.

Conclusion

Hirohito Ohhata's work in semiconductor packaging exemplifies innovation and dedication to advancing technology. His patents and collaborations continue to influence the industry positively.

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