Hitachi Chemical Company, Ltd.

Other

The Yokohama Rubber Co., Ltd.

Hitachi, Condenser Co., Ltd.

Naoki Fukutomi

Yoshiaki Tsubomatsu

Toshio Yamazaki

Hirohito Ohhata

Hiroshi Nomura

Fumio Inoue

Shinsuke Hagiwara

Hajime Nakayama

Noriyuki Taguchi

Kouichi Kaitou

Hidehiro Nakamura

Yoshiaki Wakashima

Akinari Kida

Susumu Naoyuki

Masahiko Itabashi

Itsuo Watanabe

Yoshihiro Takahashi

Atsushi Kuwano

Masao Kanno

Yasunobu Yoshidomi

Kazuhisa Suzuki

Masanori Nakamura

Hideo Watanabe

Shin Takanezawa

Yoshiyuki Tsuru

Toshiro Okamura

Kazumasa Takeuchi

Yorio Iwasaki

Hiroshi Takahashi

Hajime Yamazaki

Hiroyuki Wakamatsu

Tsutomu Kitakatsu

Hiroyoshi Yokoyama

Fujio Kojima

Takashi Yamadera

Toshinobu Takahashi

Kazuko Suzuki

Ritsuko Obata

Takeshi Funaki

Kunio Kawaguchi

Takuya Yasuoka

A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

Fabrication process of semiconductor package and semiconductor package

A substrate for use in a semiconductor package is fabricated by preparing a composite metal laminate consisting of a first metal layer, a second metal layer, and a carrier layer positioned in this order. The first metal layer has etching characteristics different to those of the second metal layer with respect to the same etchant. The first metal layer is selectively etched until the second metal layer is exposed, thereby forming pillar-like interconnections. The gap between the interconnections is then filled with a resin so as to form a resin base with interconnections. The carrier layer is removed from the second metal layer, and the second metal layer is selectively etched until the first metal layer or the resin base is exposed, thereby forming a conductive pattern on the resin base.

Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package

The present invention provides a process for the fabrication of a wiring board, which comprises the following steps: (a) forming a first wiring pattern on a first side of a self-supporting carrier metal foil so as to obtain a self-supporting wiring sheet comprising the carrier metal foil and the first wiring pattern; (b) superposing and pressing the first side of said self-supporting wiring sheet on and against an insulating substrate so that the first wiring pattern is_embedded in the insulating substrate and constitutes a surface with the insulating substrate; and (c) etching off desired portions of said carrier metal foil to form a second wiring pattern made of said carrier metal foil remaining on the surface constituted by the insulating substrate and the first wiring pattern. The present invention also provides the wiring board for electrical tests so fabricated.

Process for the fabrication of wiring board for electrical tests

A semiconductor device fabrication process comprising an encapsulation step of carrying out encapsulation by vacuum pressure differential printing by the use of a liquid resin encapsulant containing a solvent in an amount of from 5% by weight to 50% by weight, and preferably from 25% by weight to 50% by weight. The encapsulation step comprises: printing the liquid resin encapsulant by vacuum pressure differential printing in such a way that; the encapsulant covers at least an internal connecting terminal provided on a substrate, a semiconductor chip, and a wire interconnecting the internal connecting terminal and the semiconductor chip; and that the thickness of the encapsulant lying above the wire at the highest position of the wire comes to be at least 0.8 times the thickness of the encapsulant lying beneath the wire at the same position; and curing or drying the encapsulant.

Semiconductor device and method of fabrication thereof

A semiconductor device comprising a substrate with a cavity portion for mounting a semiconductor chip is provided to achieve a high reliability and to decrease a size and a fabricating cost. The cavity portion capable of mounting the semiconductor chip (,) at the center portion of the substrate is formed by press forming with a projected portion (,) of a die (,) while adhering a press shapeable wiring body comprising a copper wiring (,) which becomes wiring material, a barrier layer (,) such as nickel alloy or the like, and a copper foil (,) which is a carrier layer, to a plastic substrate (,), so as to have wiring (,) buried into a surface of the substrate and to form a ramp between an inner connection terminal portion connecting to the semiconductor chip (,) and an external connection terminal portion connecting to an external connection terminals (,), the internal and external connection terminal portions being two edge portions of the wiring (,).

Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device

A wiring board for electrical tests; having an insulating substrate, wiring of predetermined pattern which is embedded in the insulating substrate, and bump electrodes which are formed on the wiring and which are respectively brought into contact with corresponding electrodes of an article to-be-tested. Thus, even when the electrode pitch of the article to-be-tested such as a semiconductor device has become smaller(for example, less than 0.1 [mm]), the electrodes can be formed so as to cope with the electrical tests of the article.

Wiring board for electrical tests with bumps having polymeric coating

A wiring board is fabricated through the following steps: (A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal; (B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal; (C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and (D) etching off the carrier metal foil and the thin layer at desired parts thereof.

Fabrication process of wiring board

A photolithographically viahole-forming photosensitive element is formed of a light-transmitting base material and a photosensitive resin composition laminated as a layer on the light-transmitting base material. The photosensitive resin composition comprises:

Photolithographically viahole-forming photosensitive element comprising

The object of the present invention is to provide a wiring board fabrication process which is, not only so smooth on the surface that a fine wiring pattern can be formed thereon, but also suitable for mounting electronic parts having fine pitch terminals. The present invention is a fabrication process of a wiring board which comprises a wiring conductive line embedded in the surface of an insulating substrate so that the upper face of the conductive line and the surface of the substrate are flat, and a through-hole land which is a conductive portion projected from the surface of the substrate in a through-hole portion, which is characterized in removing the conductive portion projected from the surface of the substrate in the through-hole portion so as to have a flat surface on the surface of the substrate.

By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.

Process for producing printed wiring boards

A wiring board comprising (A) a base substrate on which the necessary wiring pattern has already been formed, and (B) a multi-layer substrate bonded to the wiring pattern side of said base substrate (A) and comprising heat-resistant resin layers and thin-film wiring patterns formed by a thin film forming method under vacuum can mount LSI chips on the substrate and realize increased density of signal wiring.

Process for producing high-density wiring board

Growing community of inventors

Yuki, Japan

Naoki Fukutomi