The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2003
Filed:
Mar. 06, 1998
Naoki Fukutomi, Yuki, JP;
Hidehiro Nakamura, Katsuta, JP;
Hajime Nakayama, Katsuta, JP;
Yoshiaki Tsubomatsu, Tsuchiura, JP;
Masanori Nakamura, Katsuta, JP;
Kouichi Kaitou, Ibaraki-ken, JP;
Atsushi Kuwano, Tsukuba, JP;
Itsuo Watanabe, Shimodate, JP;
Masahiko Itabashi, Mitsukaido, JP;
Abstract
The present invention provides a process for the fabrication of a wiring board, which comprises the following steps: (a) forming a first wiring pattern on a first side of a self-supporting carrier metal foil so as to obtain a self-supporting wiring sheet comprising the carrier metal foil and the first wiring pattern; (b) superposing and pressing the first side of said self-supporting wiring sheet on and against an insulating substrate so that the first wiring pattern is_embedded in the insulating substrate and constitutes a surface with the insulating substrate; and (c) etching off desired portions of said carrier metal foil to form a second wiring pattern made of said carrier metal foil remaining on the surface constituted by the insulating substrate and the first wiring pattern. The present invention also provides the wiring board for electrical tests so fabricated.