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For the Inventor, By the Inventor

Kyoung-gi-Do, South Korea

YongHee Kang

USPTO Granted Patents = 10

Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Kyoung-gi-Do, KR (2010 - 2015)
  • Kyoungki-do, KR (2013 - 2016)

Company Filing History:

goldMedal10 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2016

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10 patents (USPTO):Explore Patents
1. 9524958 - Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding (2016-12-20),
2. 8994048 - Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration (2015-03-31),
3. 8896133 - Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate (2014-11-25),
4. 8786076 - Semiconductor device and method of forming a thermally reinforced semiconductor die (2014-07-22),
5. 8742566 - Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers (2014-06-03),
6. 8492197 - Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate (2013-07-23),
7. 8389398 - Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers (2013-03-05),
8. 8169071 - Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers (2012-05-01),
9. 7897502 - Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers (2011-03-01),
10. 7851345 - Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding (2010-12-14),

Title: YongHee Kang: Innovator in Semiconductor Technology

Introduction

YongHee Kang is a prominent inventor based in Kyoung-gi-Do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His innovative work focuses on enhancing the efficiency and effectiveness of semiconductor devices.

Latest Patents

YongHee Kang's latest patents include groundbreaking advancements in semiconductor devices and methods. One notable patent describes a semiconductor device that incorporates a carrier with an interface layer. This interface layer can consist of non-conductive paste or film. The invention allows for the mounting of multiple semiconductor die to the carrier through a process that increases throughput by utilizing short pressing times followed by simultaneous thermal compression bonding. Another patent details a method for forming recesses in a substrate to accommodate semiconductor die of varying sizes. This method employs a wet etch process to create recesses and a dry etch process for forming conductive vias, ultimately enhancing the electrical connections within the device.

Career Highlights

YongHee Kang is currently employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing methods that improve the manufacturing processes of semiconductor devices, thereby contributing to advancements in the industry.

Collaborations

YongHee has collaborated with talented coworkers such as KiYoun Jang and Sungsoo Kim. Their combined expertise has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the semiconductor field.

Conclusion

YongHee Kang's contributions to semiconductor technology are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of the industry.

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