The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Mar. 27, 2012
Kiyoun Jang, Kyoungki-do, KR;
Sungsoo Kim, Seoul, KR;
Yonghee Kang, Kyoung-gi-Do, KR;
STATS ChipPAC, Ltd., Singapore, SG;
Abstract
A method of making a semiconductor device comprises providing a carrier, forming a first conductive layer extending above a surface of the carrier, providing a substrate, disposing the first conductive layer into a first surface of the substrate, removing the carrier, forming a second conductive layer extending above the first surface of the substrate to create a vertical offset between the first conductive layer and second conductive layer, and forming a plurality of first bumps over the first conductive layer and second conductive layer. The method further includes the steps of disposing a third conductive layer into a second surface of the substrate opposite the first surface of the substrate, forming a fourth conductive layer extending above the second surface of the substrate to create a vertical offset between the third conductive layer and fourth conductive layer, and forming a plurality of second bumps.