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For the Inventor, By the Inventor

Kyoungki-do, South Korea

KiYoun Jang

USPTO Granted Patents = 21 

Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 97(Granted Patents)


Location History:

  • Kyoungiki-do, KR (2014)
  • Kyoungki-do, KR (2011 - 2018)

Company Filing History:

goldMedal21 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2011-2018

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21 patents (USPTO):Explore Patents
1. 10096540 - Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance (2018-10-09),
2. 9460972 - Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection (2016-10-04),
3. 9236332 - Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe (2016-01-12),
4. 9230933 - Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure (2016-01-05),
5. 9117812 - Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability (2015-08-25),
6. 9054100 - Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrate (2015-06-09),
7. 9030030 - Semiconductor device and method of forming adjacent channel and dam material around die attach area of substrate to control outward flow of underfill material (2015-05-12),
8. 8896133 - Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate (2014-11-25),
9. 8884339 - Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process (2014-11-11),
10. 8742566 - Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers (2014-06-03),
11. 8642384 - Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability (2014-02-04),
12. 8563418 - Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces (2013-10-22),
13. 8519536 - Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process (2013-08-27),
14. 8492197 - Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate (2013-07-23),
15. 8409978 - Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe (2013-04-02),

Title: **Innovations by KiYoun Jang in Semiconductor Technology**

Introduction

KiYoun Jang, located in Kyoungki-do, South Korea, is an accomplished inventor known for his significant contributions to semiconductor technology. With a total of 21 patents to his name, Jang continues to push the boundaries of innovation in this critical field.

Latest Patents

Among his recent innovations are two notable patents. The first patent describes a "Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance." This technology ensures effective height management of dummy pillars, which enhance the integrity and performance of semiconductor devices. His second latest patent focuses on methods for achieving "reduced surface roughness in molded underfill for improved C-SAM inspection." This invention optimizes the encapsulation process, resulting in enhanced surface quality and inspection capabilities for semiconductor devices.

Career Highlights

KiYoun Jang has made significant strides in his career while working at Stats Chippac Pte. Ltd. His expertise in semiconductor devices and methods has led to multiple groundbreaking patents, solidifying his reputation as a leading inventor in the industry. His continuous research and development efforts have opened up new avenues for improving semiconductor efficiency and reliability.

Collaborations

Throughout his career, Jang has collaborated with talented individuals, including colleagues KyungHoon Lee and YongHee Kang. Their combined expertise fosters an environment of creative problem-solving and innovation, contributing to the success of their projects and the advancement of semiconductor technologies.

Conclusion

KiYoun Jang stands out as a prominent figure in semiconductor innovation. His inventive spirit and dedication to pioneering new technologies undoubtedly influence the future of the industry. With 21 patents under his name and ongoing efforts in research and collaboration, Jang's contributions will continue to propel advancements in semiconductor devices for years to come.

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