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For the Inventor, By the Inventor

Songjiang, China

Yong She

This inventor holds 24 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Huawei Technologies Co., Limited. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong She. Retrieved from https://idiyas.com/inventor/yong-she

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 24 

% Patents Active = 95.8

 

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 30(Granted Patents)


Location History:

  • Minghang, CN (2017)
  • Folsom, CA (US) (2018)
  • Songjiang, CN (2019 - 2024)
  • Shanghai, CN (2022 - 2024)

Company Filing History:

goldMedal23 out of 56,394 
 
Intel Corporation
 patents
silverMedal1 out of 27,558 
 
Huawei Technologies Co., Limited
 patents

Years Active: 2017-2025

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Areas of Expertise:
Chip Transfer Method
Integrated Circuit Package
Ball Grid Array
Stacked Die
Interconnect Structure
Solder Joint Reliability
Die Attach Film
System in Package
Memory Module
Wire Bond Connection
Flexible Solutions
24 patents (USPTO):Explore Patents
1. 12512360 - Chip transfer method and electronic device (2025-12-30),
2. 12046581 - Integrated circuit package with glass spacer (2024-07-23),
3. 12027496 - Film in substrate for releasing z stack-up constraint (2024-07-02),
4. 11990395 - Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement (2024-05-21),
5. 11894344 - Power enhanced stacked chip scale package solution with integrated die attach film (2024-02-06),
6. 11881441 - Stacked die semiconductor package spacer die (2024-01-23),
7. 11848281 - Die stack with reduced warpage (2023-12-19),
8. 11830848 - Electronic device package (2023-11-28),
9. 11742284 - Interconnect structure fabricated using lithographic and deposition processes (2023-08-29),
10. 11538746 - Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same (2022-12-27),
11. 11393788 - Integrated circuit package with glass spacer (2022-07-19),
12. 11302671 - Power enhanced stacked chip scale package solution with integrated die attach film (2022-04-12),
13. 11081451 - Die stack with reduced warpage (2021-08-03),
14. 10991679 - Stair-stacked dice device in a system in package, and methods of making same (2021-04-27),
15. 10930622 - Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same (2021-02-23),

Title: Inventor Yong She - Revolutionizing Technology in Songjiang, China

Introduction: Yong She is a visionary inventor based in Songjiang, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yong She holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more efficient and eco-friendly future.

Career Highlights: With a career spanning over two decades, Yong She has worked tirelessly to develop cutting-edge solutions that have revolutionized various industries. His innovative approach has earned him recognition as a pioneer in the tech world.

Collaborations: Yong She has collaborated with leading research institutions, universities, and tech companies to further his inventions and bring them to the market. His partnerships have been instrumental in pushing the boundaries of what is possible in the realm of technology.

Conclusion: Yong She's passion for innovation, coupled with his relentless drive to make a positive impact on the world, solidifies his position as a trailblazing inventor in Songjiang, China, and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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