The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Jul. 20, 2021
Huawei Technologies Co., Ltd., Shenzhen, CN;
Haohui Long, Beijing, CN;
Shanshan Wei, Shanghai, CN;
Yong She, Shanghai, CN;
Jianping Fang, Beijing, CN;
Huawei Technologies Co., Ltd., Shenzhen, CN;
Abstract
A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; sticking the stretchable layer to chips, where the first cloth layer is closer to the chips than the second cloth layer; then, separating a plurality of chips, where the plurality of separated chips are separately connected to the first fiber and the second fiber; respectively disposing, at a plurality of preset locations of the substrate, the plurality of chips stuck to the stretchable layer; and removing the first fiber and the second fiber.