Taichung, Taiwan

Yi-Chien Wu


Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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13 patents (USPTO):Explore Patents

Title: Yi-Chien Wu: Innovating Semiconductor MEMS Structures

Introduction

Yi-Chien Wu is a prominent inventor based in Taichung, Taiwan. With an impressive portfolio of 11 patents, he has significantly contributed to the field of semiconductor technology. His innovative work revolves around MEMS (Micro-Electro-Mechanical Systems) structures, showcasing a commitment to advancing modern electronics.

Latest Patents

Among his most recent innovations, Yi-Chien Wu has developed a patent for a Semiconductor MEMS structure. This invention encompasses a unique structure that features a cavity enclosed by a first substrate and a second substrate opposite each other. The design includes a significant feature protruding from the first substrate's surface, enhanced by a dielectric layer that interfaces with this feature. The dielectric layer plays a crucial role, as one surface is in direct contact with the feature while the opposing surface is directed toward the cavity, illustrating a refined approach to MEMS fabrication.

Career Highlights

Yi-Chien Wu has built his career at esteemed organizations, including Taiwan Semiconductor Manufacturing Company Limited and the University of California. His experience in these institutions has provided him with a strong foundation to pioneer advancements in semiconductor technologies and MEMS structures.

Collaborations

In his professional journey, Yi-Chien Wu has collaborated with notable colleagues, including Jung-Huei Peng and Yuan-Chih Hsieh. These partnerships have further enriched his work and have encouraged a collaborative spirit within the landscape of semiconductor research.

Conclusion

As an accomplished inventor, Yi-Chien Wu continues to push the boundaries of technology through his innovative semiconductor MEMS structures. His contributions not only advance technical understanding but also inspire future generations of inventors in the field.

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