The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jul. 08, 2016
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Shiang-Chi Lin, Taoyuan, TW;

Jung-Huei Peng, Jhubei, TW;

Yu-Chia Liu, Kaohsiung, TW;

Yi-Chien Wu, Taichung, TW;

Wei Siang Tan, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); B81B 3/00 (2006.01); H01L 23/02 (2006.01); H01L 21/54 (2006.01); H01L 21/322 (2006.01); H01L 23/26 (2006.01); H01L 29/84 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0038 (2013.01); B81C 1/00285 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/04 (2013.01); B81B 2207/07 (2013.01); B81C 2201/013 (2013.01); B81C 2201/016 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0714 (2013.01);
Abstract

A microelectromechanical systems (MEMS) package with high gettering efficiency is provided. A MEMS device is arranged over a logic chip, within a cavity that is hermetically sealed. A sensing electrode is arranged within the cavity, between the MEMS device and the logic chip. The sensing electrode is electrically coupled to the logic chip and is a conductive getter material configured to remove gas molecules from the cavity. A method for manufacturing the MEMS package is also provided.


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