The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Apr. 29, 2016
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Yuan-Chih Hsieh, Hsinchu, TW;
Hsing-Lien Lin, Hsin-Chu, TW;
Jung-Huei Peng, Hsinchu Hsien, TW;
Yi-Chien Wu, Taichung, TW;
Taiwan Semiconductor Manufacturing Company Ltd., Hsin-Chu, TW;
Abstract
The present disclosure provides a method of manufacturing a structure. The method comprises: providing a first substrate; forming a plurality of conductive pads over the first substrate; forming a film on a first subset of the plurality of conductive pads, thereby leaving a second subset of the plurality of conductive pads exposed from the film; forming a self-assembled monolayer (SAM) over the film; and forming a cavity by the first substrate and a second substrate through bonding a portion of the second substrate to the second subset of the plurality of conductive pads that are exposed from the film.