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For the Inventor, By the Inventor

Suwon, South Korea

Yee Na Shin

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 31(Granted Patents)


Location History:

  • Seoul, KR (2013)
  • Suwon, KR (2015 - 2018)
  • Suwon-Si, KR (2015 - 2021)

Company Filing History:

goldMedal14 out of 7,574 
 
Samsung Electro-mechanics Co., Ltd.
 patents

Years Active: 2013-2021

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14 patents (USPTO):Explore Patents
1. 10887995 - Method for manufacturing a printed circuit board including an embedded electronic component (2021-01-05),
2. 10015884 - Printed circuit board including embedded electronic component and method for manufacturing the same (2018-07-03),
3. 9788433 - Circuit board and method of manufacturing the same (2017-10-10),
4. 9526177 - Printed circuit board including electronic component embedded therein and method for manufacturing the same (2016-12-20),
5. 9504169 - Printed circuit board having embedded electronic device and method of manufacturing the same (2016-11-22),
6. 9474167 - Multilayered substrate (2016-10-18),
7. 9462697 - Electronic component embedded substrate and manufacturing method thereof (2016-10-04),
8. 9420683 - Substrate embedding passive element (2016-08-16),
9. 9345141 - Multilayer ceramic capacitor and printed circuit board including the same (2016-05-17),
10. 9313893 - Substrate having electronic component embedded therein and method of manufacturing the same (2016-04-12),
11. 9307632 - Multilayered substrate and method of manufacturing the same (2016-04-05),
12. 9171780 - Method for manufacturing semiconductor package (2015-10-27),
13. 9155199 - Passive device embedded in substrate and substrate with passive device embedded therein (2015-10-06),
14. 8450844 - Semiconductor package and method of manufacturing the same (2013-05-28),

Title: Innovations of Yee Na Shin in Printed Circuit Board Technology

Introduction

Yee Na Shin is a prominent inventor based in Suwon, South Korea, known for his significant contributions to the field of printed circuit board (PCB) technology. With a total of 14 patents to his name, he has made remarkable advancements that enhance the functionality and efficiency of electronic components.

Latest Patents

Among his latest patents, Yee Na Shin has developed a method for manufacturing a printed circuit board that includes an embedded electronic component. This innovative PCB features a core with a cavity that houses an electronic component. The component is designed with a rough surface on the external electrodes, which improves connectivity. Additionally, a low rough surface is formed on part of the rough surfaces, enhancing the overall performance of the PCB. The insulating layers are laminated on both the upper and lower portions of the core, securely bonding to the outer circumferential surface of the embedded electronic component. An external circuit pattern is also provided on the insulating layers, further optimizing the PCB's functionality.

Career Highlights

Yee Na Shin is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate and develop cutting-edge technologies in the electronics sector. His work has significantly impacted the design and manufacturing processes of printed circuit boards, making them more efficient and reliable.

Collaborations

Throughout his career, Yee Na Shin has collaborated with notable colleagues, including Yul Kyo Chung and Seung Eun Lee. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Yee Na Shin's contributions to printed circuit board technology exemplify the spirit of innovation in the electronics industry. His patents not only reflect his expertise but also pave the way for future advancements in the field.

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