Suwon, South Korea

Yee Na Shin

This inventor holds 14 USPTO granted patents and 14 published patent applications, primarily in Printed Circuit Boards. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2013-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yee Na Shin. Retrieved from https://idiyas.com/inventor/yee-na-shin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14 

% Patents Active = 71.4

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 31(Granted Patents)


Location History:

  • Seoul, KR (2013)
  • Suwon, KR (2015 - 2018)
  • Suwon-Si, KR (2015 - 2021)

Company Filing History:


Years Active: 2013-2021

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Areas of Expertise:
Printed Circuit Board
Embedded Component
Multilayer Substrate
Manufacturing Method
Semiconductor Package
Passive Device
Electronic Component
Multilayer Ceramic Capacitor
Substrate Embedding
Circuit Board
14 patents (USPTO):Explore Patents

Title: Innovations of Yee Na Shin in Printed Circuit Board Technology

Introduction

Yee Na Shin is a prominent inventor based in Suwon, South Korea, known for his significant contributions to the field of printed circuit board (PCB) technology. With a total of 14 patents to his name, he has made remarkable advancements that enhance the functionality and efficiency of electronic components.

Latest Patents

Among his latest patents, Yee Na Shin has developed a method for manufacturing a printed circuit board that includes an embedded electronic component. This innovative PCB features a core with a cavity that houses an electronic component. The component is designed with a rough surface on the external electrodes, which improves connectivity. Additionally, a low rough surface is formed on part of the rough surfaces, enhancing the overall performance of the PCB. The insulating layers are laminated on both the upper and lower portions of the core, securely bonding to the outer circumferential surface of the embedded electronic component. An external circuit pattern is also provided on the insulating layers, further optimizing the PCB's functionality.

Career Highlights

Yee Na Shin is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate and develop cutting-edge technologies in the electronics sector. His work has significantly impacted the design and manufacturing processes of printed circuit boards, making them more efficient and reliable.

Collaborations

Throughout his career, Yee Na Shin has collaborated with notable colleagues, including Yul Kyo Chung and Seung Eun Lee. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Yee Na Shin's contributions to printed circuit board technology exemplify the spirit of innovation in the electronics industry. His patents not only reflect his expertise but also pave the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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