The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Mar. 18, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Doo Hwan Lee, Daejeon, KR;
Yul Kyo Chung, Yongin-si, KR;
Yee Na Shin, Suwon-si, KR;
Seung Eun Lee, Sungnam-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/002 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/0271 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/4605 (2013.01); H05K 3/4697 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H05K 3/4644 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/1469 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on a surface of the first build-up insulating layer.