The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Dec. 30, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Doo Hwan Lee, Daejeon, KR;
Yul Kyo Chung, Yongin, KR;
Yee Na Shin, Suwon, KR;
Seung Eun Lee, Sungnam, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/642 (2013.01); H05K 1/185 (2013.01); H01L 2224/16225 (2013.01); H05K 1/115 (2013.01); H05K 1/182 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01);
Abstract
A substrate embedding a passive element includes a first conductor pattern layer disposed on a lower surface thereof and a second conductor pattern layer disposed on an upper surface thereof; a first via electrically connecting between the passive element and the first conductor pattern layer; and a second via electrically connecting between the passive element and the second conductor pattern layer, in which a volume of the first via is larger than that of the second via.