The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Dec. 30, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Doo Hwan Lee, Daejeon, KR;
Ho Shik Kang, Yeongi-gun, KR;
Yee Na Shin, Suwon, KR;
Yul Kyo Chung, Yongin, KR;
Seung Eun Lee, Sungnam, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 24/18 (2013.01); H05K 1/185 (2013.01); H05K 3/4688 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/73267 (2013.01); H05K 3/0097 (2013.01); H05K 3/4682 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/068 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/1572 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49155 (2015.01);
Abstract
A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component.