This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2016.
Company Filing History:
Years Active: 2016
Title: Ho Shik Kang: Innovator in Electronic Component Technology
Introduction
Ho Shik Kang is a notable inventor based in Yeongi, South Korea. He has made significant contributions to the field of electronic components, holding a total of 2 patents. His work focuses on improving the manufacturing processes and performance of electronic component embedded substrates.
Latest Patents
Kang's latest patents include innovative technologies aimed at reducing warpage in electronic components. The first patent, titled "Electronic component embedded substrate and method for manufacturing electronic component embedded substrate," introduces a design that minimizes unnecessary wiring while ensuring structural integrity. This invention features a first wiring layer with a higher number of layers and wiring density compared to the second wiring layer, along with insulating portions made from materials with differing coefficients of thermal expansion.
The second patent, "Multilayered substrate and method of manufacturing the same," describes a multilayered substrate that incorporates multiple wiring and reinforcing layers. This design is specifically engineered to decrease warpage and optimize wiring patterns based on the external electrode scheme of electronic components.
Career Highlights
Ho Shik Kang is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in electronic components. His work has been instrumental in advancing the capabilities of electronic substrates, making them more efficient and reliable.
Collaborations
Throughout his career, Kang has collaborated with esteemed colleagues such as Doo Hwan Lee and Yul Kyo Chung. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Ho Shik Kang is a prominent figure in the realm of electronic component innovation. His patents reflect a commitment to enhancing the performance and manufacturing processes of electronic substrates. His contributions are paving the way for advancements in the electronics industry.