Samsung Electro-Mechanics Co., Ltd.

Ho Shik Kang

Doo Hwan Lee

Seung Eun Lee

Yul Kyo Chung

Yee Na Shin

Tae Kyun Bae

The present invention can reduce warpage while minimizing unnecessary wiring of an electronic component embedded substrate by including an electronic component; a first wiring layer; and a second wiring layer, wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of the number of layers and wiring density of the second wiring layer and a first insulating portion is made of a material having a lower coefficient of thermal expansion than a second insulating portion.

Electronic component embedded substrate and method for manufacturing electronic component embedded substrate

A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component.

Growing community of inventors

Yeongi-gun, South Korea

Ho Shik Kang